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品類
Other Components
82,412個料號
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SOIC
0603
0805
1206
0402
TSSOP
DIP
QFN
LQFP
1210
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2512
SOT-23-5
TQFP
MSOP
DFN
VQFN
SOT-23-3
0201
SOT-23
2010
VSSOP
FBGA
WSON
1812
DPAK
HTSSOP
SOP
SOT-23-6
D2PAK
BGA
WQFN
TO-220
TO-92-3
TO-220AB
WLCSP
QSOP
SOT-323
UDFN
TO-220-3
SOT-223
UQFN
TO-247
SON
TO-252
TO-236AB
SOT-363
SOT-25
TFBGA
TO-247-3
QFP
TO-263
VFBGA
TO-252-3
DDPAK
SOT-89-3
SOT-563
SOT-223-3
SOT-89
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125700D00000G
Boyd Laconia, LLC · SOLDER ANCHOR FOR BGA HEATSINKS
BGA
有貨
USD 0.5813
+
125800D00000G
Boyd Laconia, LLC · SOLDER ANCHOR FOR BGA HEATSINKS
BGA
有貨
USD 0.2475
+
EPC2252
EPC · TRANSGAN 80V.011OHM AECQ101 9BGA
9BGA
有貨
USD 2.2094
+
374124B00035G
Boyd Laconia, LLC · HEATSINK BGA W/ADHESIVE TAPE
BGA
有貨
USD 1.7487
+
LTM2882IY-3#PBF
Analog Devices Inc. · DGT ISO 2500VRMS 4CH RS232 32BGA
32BGA
有貨
USD 23.5620
+
TSB41AB1ZQER-64
Texas Instruments · INTEGRATED CIRCUIT BGA
BGA
有貨
USD 2.8708
+
HSB18-232310
CUI Devices · HEAT SINK, BGA, 23 X 23 X 10 MM
BGA
有貨
USD 0.9082
+
374024B00035G
Boyd Laconia, LLC · HEATSINK BGA 23X23X10MM W/ADH
BGA
有貨
USD 1.7201
+
HSB08-212106
CUI Devices · HEAT SINK, BGA, 21 X 21 X 6 MM
BGA
有貨
USD 0.8007
+
ADSP-21569KBCZ10
Analog Devices Inc. · 1000 MHZ SHARC WITH DDR IN A BGA
BGA
有貨
USD 28.9699
+
374324B60023G
Boyd Laconia, LLC · BGA HEAT SINK
BGA
有貨
USD 3.1061
+
374724B00032G
Boyd Laconia, LLC · HEATSINK BGA W/ADHESIVE TAPE
BGA
有貨
USD 3.3159
+
HX5401NLT
Pulse Electronics · XFRMR MODULE QUAD 1GP 1:1 BGA
BGA
有貨
USD 20.4796
+
HSB11-252518
CUI Devices · HEAT SINK, BGA, 25 X 25 X 18 MM
BGA
有貨
USD 1.1566
+
375024B00032G
Boyd Laconia, LLC · HEATSINK BGA W/ADHESIVE TAPE
BGA
有貨
USD 2.7327
+
HSB04-171706
CUI Devices · HEAT SINK, BGA, 17 X 17 X 6 MM
BGA
有貨
USD 0.7393
+
LTM2882IY-5#PBF
Analog Devices Inc. · DGT ISO 2500VRMS 4CH RS232 32BGA
32BGA
有貨
USD 23.6073
+
HSB31-212105
CUI Devices · HEAT SINK, BGA, 21 X 21 X 5 MM
BGA
有貨
USD 0.7775
+
ADSP-21569KBCZ8
Analog Devices Inc. · 800 MHZ SHARC WITH DDR IN A BGA
BGA
有貨
USD 27.5549
+
HSB26-343408
CUI Devices · HEAT SINK, BGA, 33.5 X 33.5 X 8
BGA
有貨
USD 1.1049
+
HSB30-373710
CUI Devices · HEAT SINK, BGA, 37.4 X 37 X 10 M
BGA
有貨
USD 2.1194
+
374724B00035G
Boyd Laconia, LLC · HEATSINK BGA 35X35X18MM W/ADH
BGA
有貨
USD 3.6376
+
HSB25-282810
CUI Devices · HEAT SINK, BGA, 28.5 X 28.5 X 10
BGA
有貨
USD 1.2651
+
ATSAMA5D28C-D1G-CUR
Microchip Technology · BGA GREEN, IND TEMP,MRLC,1GBIT D
BGA
有貨
USD 28.4061
+
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