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品類
Other Components
82,412個料號
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SOIC
0603
0805
1206
0402
TSSOP
DIP
QFN
LQFP
1210
SSOP
SO
2512
SOT-23-5
TQFP
MSOP
DFN
VQFN
SOT-23-3
0201
SOT-23
2010
VSSOP
FBGA
WSON
1812
DPAK
HTSSOP
SOP
SOT-23-6
D2PAK
BGA
WQFN
TO-220
TO-92-3
TO-220AB
WLCSP
QSOP
SOT-323
UDFN
TO-220-3
SOT-223
UQFN
TO-247
SON
TO-252
TO-236AB
SOT-363
SOT-25
TFBGA
TO-247-3
QFP
TO-263
VFBGA
TO-252-3
DDPAK
SOT-89-3
SOT-563
SOT-223-3
SOT-89
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料號 A–Z
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HSE05-171933
CUI Devices · HEAT SINK, EXTRUSION, TO-218/TO-
TO-218
有貨
USD 1.3579
+
HSE06-503045
CUI Devices · HEAT SINK, EXTRUSION, TO-218/TO-
TO-218
有貨
USD 2.2275
+
HSE04-251265-1
CUI Devices · HEAT SINK, EXTRUSION, TO-218/TO-
TO-218
有貨
USD 0.8556
+
593101B03600G
Boyd Laconia, LLC · HEATSINK TO-218/TO-247 TAB
TO-218
有貨
USD 9.8699
+
HSE-B18508-035H
CUI Devices · HEAT SINK, EXTRUSION, TO-218, 50
TO-218
有貨
USD 1.7136
+
HSE09-755028
CUI Devices · HEAT SINK, EXTRUSION, TO-218/TO-
TO-218
有貨
USD 3.2200
+
HSE07-753045
CUI Devices · HEAT SINK, EXTRUSION, TO-218/TO-
TO-218
有貨
USD 3.1752
+
530101B00150G
Boyd Laconia, LLC · HEATSINK 1.75" HI RISE TO-218
TO-218
有貨
USD 4.0110
+
HSS08-B18-CP
CUI Devices · HEAT SINK, STAMPING, TO-218, 44.
TO-218
有貨
USD 1.8783
+
HSE-B18254-035H-00
CUI Devices · HEAT SINK, EXTRUSION, TO-218, 25
TO-218
有貨
USD 1.4872
+
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